Diamond Wire Saw Concept – Meyer Burger DW 288

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Rocking head 12 Deg (24 Deg total) reduces contact point, critical for slicing hard materials such as sapphire and ruby.

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Fixed diamond particles electroplated to steel core wire. Wire kerf of 250µm + 5 to 20 micron additional kerf based on diamond wire mfg.


Wire Saw Concept (Slurry) – Meyer Burger DS 261

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A slurry (comprised of an abrasive grain and glycol) is directed onto the wire web and transported to the cutting interface by fast moving wire (10 m/sec).

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Low kerf loss is provided by a thin wire at 175 µm, an additional 40 µm of material is lost from the grain that is used.